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Datasheet

Modified on: Fri, 6 Mar, 2020 at 6:05 PM

Please find the following document available for download below:

Xeed- Safety information V01-02.pdf

Leapfrog Xeed Datasheet _ Specifications V01-08.pdf

Leapfrog Xeed Datasheet _ Specifications V01-08.pdf

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User Manual

Filament Guide

ABS

Extrude at ~ 225^o C.
Requires heated bed.
Works reasonably well without cooling.
Adheres best to polyimide tape.
Filament tolerances are usually tighter.
Prone to cracking, delamination, and wraping.
More flexible.
Can be bonded using adhesives or solvents(Acetone or MEK).
Fumes are unpleasent in enclosed areas.
Oil Based.

PLA

Extrude at ~ 180-225^o C.
Benefits from heated bed.
Benefits greatly from cooling while printing.
Adheres well to a variety of surfaces.
Finer feature detail possible on a well calibrated machine.
Prone to curling of corners and overhangs.
More brittle.
Can be bonded using adhesives.
More pleasant smell when extruded.
Plant Based.

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